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* first finalised revisionhmjsp2026-09-091-0/+11233
| | | | no major changes expected, only oversights to be corrected if at all
* third drafthmjsp2026-09-091-319/+425
| | | | widen castellation pads, change routing accordingly
* second drafthmjsp2026-09-091-1071/+1327
| | | | | - change footprint to be more accurate for castellated soldering - change routing accordingly
* PCB first drafthmjsp2026-09-091-1341/+2595
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* initial commithmjsp2026-09-071-0/+29890